Documentation
S neox Brochure
Applications
Our products are designed to solve inspection requirements in the field of semiconductors, microelectronics, optics, and surface finishing. Covering the large markets of advanced manufacturing and consumer electronics.
Case studies
8 May, 2026
Francesc Marginedas, Miguel Ángel Moreno-Ibáñez, Antonio Rodríguez-Hidalgo and Palmira Saladié
Within this research line at IPHES-CERCA, advanced microscopy and 3D surface analysis are used to understand bone-surface modifications related to human behavior, violence, cannibalism, and funerary practices in archaeological contexts.
3 March, 2026
Antonio Catelluccio & Ryan Torres
With this study, has been proved that S neox Five Axis enables depth evaluation, thread geometry characterization, radial deviation measurement, and GD&T inspection and demonstrated the visual versatility and dimensional diversity.
14 January, 2026
Dr. Mahdi Nekahi
This study successfully achieved a comprehensive quantitative and qualitative characterization of solid particle erosion (SPE) in bulk alumina, neat epoxy resin, and alumina-reinforced polymer composites under different impact angles and velocities.
11 June, 2025
Fiona Pichon and Andrea Zupancich
In this study, the different surface topographies obtained through the 3D profiler provide valuable insights into using ground stone and obsidian tools. These observations help us to further explore dietary practices and the evolution of human-plant interactions over time, as well as trace the development of more complex socioeconomic systems and social networks.
19 April, 2023
Natalia Bermejo
Optical profilometers provide valuable information to help manufacturers optimize their tools and processes.
17 April, 2023
David Páez
The need for surface metrology for the CMP process is evident given that mechanical interaction between the surfaces is a critical variable for all stages of the process. The surfaces that need to be periodically characterized throughout the process include the conditioning disk surface, the wafer surface and the pad surface.
Get answers to your questions!
Connect with an expert
Just write us an email or search for
a direct contact near you.
