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cs13 Sensofar Metrology - CMP process H

In-situ metrology for pad surface monitoring in CMP

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The need for surface metrology for the CMP process is evident given that mechanical interaction between the surfaces is a critical variable for all stages of the process. The surfaces that need to be periodically characterized throughout the process include the conditioning disk surface, the wafer surface and the pad surface.

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cs21 Linkam - silicon wafer H

Characterizing the temperature-induced evolution of the shape and texture of a silicon wafer

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In this case study, Linkam and Sensofar Metrology demonstrate their collaboration in producing an experimental setup for temperature-controlled optical profilometry experiments.

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cs16 EPFL - mask films H

Precise thickness measurements of thin SiO2 mask films

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We study the optical properties of QDs that are embedded in PhC cavities, leading to enhanced emission (the Purcell effect), or in WGs, producing photon multiplexing devices.

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cs15 EPFL - membrane photonic crystal devices H

Non-destructive characterization of membrane photonic crystal devices

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The study is based on the optical properties of QDs that are embedded in PhC cavities, leading to enhanced emission (the Purcell effect), or in WGs, producing photon multiplexing devices.

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cs7 KIT - OLED H

Laser structuring of organic optoelectronic devices

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The task of this work was to build large-scale organic light-emitting diodes (OLEDs) for luminaires. This required an invisible series connection of OLEDs to reduce the device current and hence to mitigate ohmic losses. A femtosecond laser was used to selectively structure the layers.

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cs2 CNM - nano pressure sensor H

Measurements of the initial deflection of a nano pressure sensor for biological applications

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In the fabrication of nano pressure sensors for biological applications, the sacrificial layer etching and the sealing of the two membranes separated by a vacuum gap to form a Fabry–Pérot resonator is critical.

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